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0584773 - ÚPT 2024 CZ eng A - Abstract
Podstránský, Jáchym - Schreiner, R. - Hausladen, M.
Multiple electron-beam emission beam by tip.
IMAPS Flash Conference. 9th International Microelectronics Assembly and Packaging Society Flash Conference. Extended abstracts. Brno: Brno University of Technology, FEEC, 2023 - (Otáhal, A.; Szendiuch, I.; Skácel, J.). s. 52-53. ISBN 978-80-214-6185-7.
[IMAPS Flash Conference 2023. International Microelectronics Assembly and Packaging Society Flash Conference /9./. 26.10.2023-27.10.2023, Brno]
Institutional support: RVO:68081731
Permanent Link: https://hdl.handle.net/11104/0352621