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0543531 - ÚSMH 2022 RIV CH eng J - Journal Article
Suchý, Tomáš - Vištejnová, L. - Šupová, Monika - Klein, P. - Bartoš, M. - Kolinko, Y. - Blassová, T. - Tonar, Z. - Pokorný, M. - Sucharda, Zbyněk - Žaloudková, Margit - Denk, František - Ballay, R. - Juhás, Štefan - Juhásová, Jana - Klapková, E. - Horný, L. - Sedláček, R. - Grus, T. - Čejka jr., Z. - Čejka, Z. - Chudějová, K. - Hrabák, J.
Vancomycin-Loaded Collagen/Hydroxyapatite Layers Electrospun on 3D Printed Titanium Implants Prevent Bone Destruction Associated with S. epidermidis Infection and Enhance Osseointegration.
Biomedicines. Roč. 9, č. 5 (2021), č. článku 531. E-ISSN 2227-9059
R&D Projects: GA TA ČR(CZ) TA04010330
Institutional support: RVO:67985891 ; RVO:67985904
Keywords : orthopedic implant * collagen * hydroxyapatite * vancomycin * implant-related bone infection * Staphylococcus epidermidis * osseointegration * bone * rat * minipig
OECD category: Medical engineering; Technologies involving the manipulation of cells, tissues, organs or the whole organism (assisted reproduction) (UZFG-Y)
Impact factor: 4.757, year: 2021
Method of publishing: Open access
https://www.mdpi.com/2227-9059/9/5/531
Permanent Link: http://hdl.handle.net/11104/0320826