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0353414 - ÚFM 2011 RIV JP eng J - Journal Article
Man, O. - Pantělejev, L. - Kunz, Ludvík
Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction.
Materials Transactions. Roč. 51, č. 2 (2010), s. 209-213. ISSN 1345-9678. E-ISSN 1347-5320
R&D Projects: GA AV ČR 1QS200410502
Institutional research plan: CEZ:AV0Z20410507
Keywords : ultra-fine grained copper * thermal stability of microstructure * electron back scattering diffraction * grain size * texture
Subject RIV: JG - Metallurgy
Impact factor: 0.779, year: 2010
Permanent Link: http://hdl.handle.net/11104/0192669