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Heat conduction in microstructured solids under localised pulse loading

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Abstract

The influence of a microstructure on heat conduction in solids is studied using the internal variable approach. Two variants of the internal variable treatment are compared by means of the numerical simulation of two-dimensional heat conduction in a plate under a localised thermal pulse loading. Computation of the same problem by the different internal variable descriptions produces qualitatively dissimilar results. The single internal variable approach leads to a diffusional type of the internal variable evolution. In contrast, the dual internal variable technique provides a wave-like evolution of the internal variables and, as the consequence, the corresponding wave-like heat transfer. The results are obtained in the dimensionless form, and parameters of models are chosen to emphasise the features of each model.

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Acknowledgements

The work was supported by the Estonian Research Council under Institutional Research Funding IUT33-24 and Research Project RPG1227, and by the Centre of Excellence for Nonlinear Dynamic Behaviour of Advanced Materials in Engineering CZ.02.1.01/0.0/0.0/15_003/0000493 (Excellent Research Teams) in the framework of Operational Programme Research, Development and Education within institutional support RVO:61388998.

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  1. Department of Cybernetics, School of Science, Tallinn University of Technology, Akadeemia 21, 12618, Tallinn, Estonia

    Arkadi Berezovski

  2. Institute of Thermomechanics, v.v.i., The Czech Academy of Sciences, Dolejškova 1402/5, 182 00, Prague 8, Czech Republic

    Arkadi Berezovski

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  1. Arkadi Berezovski
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Correspondence to Arkadi Berezovski.

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Berezovski, A. Heat conduction in microstructured solids under localised pulse loading. Continuum Mech. Thermodyn. 33, 2493–2507 (2021). https://doi.org/10.1007/s00161-021-01032-0

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