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Émissivité à basse température de couches minces d'Al2O3 déposées sur un substrat de cuivre.

Low-temperature emissivity of thin AL2O3 layers deposited on copper substrate.

Numéro : 0042

Auteurs : FROLEC J., KRALIK T., NYMAN L., PUDAS M., KALLIO E.

Résumé

Copper is commonly used in cryogenic systems due to its high thermal and electrical conductivity along with excellent solderability. Very low emissivity values of copper surface also reduce in cryogenic systems heat load transferred by thermal radiation. These values may be, however, enhanced by a prospective coating, deposited usually in order to prevent chemical changes on highly reactive copper surface. This paper focuses on protective layers of Al2O3 with thicknesses up to 28 nm, deposited on polished copper. We measured total hemispherical emissivity at cryogenic temperatures before and after the coating process. Contribution of Al2O3 layer to original copper emissivity increased with rising temperature of the layer and with the layer thickness. However, emissivity of the coated copper stayed below 2%, allowing usage of the coated copper in systems where low heat load by thermal radiation is needed. Preliminary tests with oxygen plasma shows that deposited layers can effectively protect the copper surface against oxidation and maintain the original thermal-radiative properties.

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Pages : 6

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Détails

  • Titre original : Low-temperature emissivity of thin AL2O3 layers deposited on copper substrate.
  • Identifiant de la fiche : 30029030
  • Langues : Anglais
  • Source : Cryogenics 2021 online. Proceedings of the 16th IIR International Conference, October 5-7, 2021.
  • Date d'édition : 05/10/2021
  • DOI : http://dx.doi.org/10.18462/iir.cryo.2021.0042
  • Document disponible en consultation à la bibliothèque du siège de l'IIF uniquement.

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