Abstract
The hybrid architecture of the Timepix (TPX) family of detectors enables the use of different semiconductor sensors, most commonly silicon (Si), as well as high-density materials such as Cadmium Telluride (CdTe) or Gallium Arsenide (GaAs). For this purpose, we explore the potential of a silicon carbide (SiC) sensor bump-bonded on a Timepix3 detector as a radiation imaging and particle tracking detector. SiC stands as a radiation-hard material also with the ability to operate at elevated temperatures up to several hundreds of degrees Celsius. As a result, this sensor material is more suitable for radiation harsh environments compared to conventional e.g., Si sensors. In this work, we evaluate the response for precise radiation spectrometry and high-resolution particle tracking of newly developed SiC Timepix3 detector which is built and operated as a compact radiation camera MiniPIX-Timepix3 with integrated readout electronics. Calibration measurements were conducted with mono-energetic proton beams with energies of 13, 22, and 31 MeV at the U-120M cyclotron at the Nuclear Physics Institute Czech Academy of Science (NPI CAS), Prague, as well as 100 and 226 MeV at the Proton Therapy Center Czech (PTC) in Prague. High-resolution pattern recognition analysis and single-particle spectral tracking are used for detailed inspection and understanding of the sensor response. Results include distributions of deposited energy and linear energy transfer (LET) spectra. The spatial uniformity of the pixelated detector response is examined in terms of homogeneously distributed deposited energy.