Počet záznamů: 1
Recovery stress and shape memory stability in Ni-Ti-Cu thin wires at high temperatures
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SYSNO ASEP 0368419 Druh ASEP J - Článek v odborném periodiku Zařazení RIV J - Článek v odborném periodiku Poddruh J Článek ve WOS Název Recovery stress and shape memory stability in Ni-Ti-Cu thin wires at high temperatures Tvůrce(i) Molnár, Peter (FZU-D) RID
Van Humbeeck, J. (BE)Zdroj.dok. International Journal of Materials Research. - : Walter de Gruyter - ISSN 1862-5282
Roč. 102, č. 11 (2011), s. 1362-1368Poč.str. 7 s. Jazyk dok. eng - angličtina Země vyd. DE - Německo Klíč. slova shape memory alloys ; recovery stress ; Ni-Ti-Cu ; stress relaxation Vědní obor RIV BM - Fyzika pevných látek a magnetismus CEZ AV0Z10100520 - FZU-D (2005-2011) UT WOS 000297955000007 DOI 10.3139/146.110596 Anotace The recovery stress evolution during thermal cycling (heating, isothermal holding, cooling) to temperatures significantly above the austenite finish temperature in Ni –Ti – Cu thin wires was evaluated in a dynamic mechanical analyser DMA TQ800. Ni –Ti–Cu wires were annealed at four different temperatures (350 °C, 450°C, 550 °C and 650 °C). It was observed that the maximum recovery stress significantly decreases with increasing annealing temperature. It was also observed that the recovery stress during four isothermal holdings shows similar behaviour for all annealing temperatures, i. e. stress relaxation occurs after initial stress increase during the first isothermal holding and no stress relaxation is observed during isothermal holdings in subsequent thermal cycles. Pracoviště Fyzikální ústav Kontakt Kristina Potocká, potocka@fzu.cz, Tel.: 220 318 579 Rok sběru 2012
Počet záznamů: 1