Počet záznamů: 1
Interaction of Silver Nanopowder with Cooper Substrate
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SYSNO ASEP 0362863 Druh ASEP J - Článek v odborném periodiku Zařazení RIV J - Článek v odborném periodiku Poddruh J Článek ve WOS Název Interaction of Silver Nanopowder with Cooper Substrate Tvůrce(i) Sopoušek, J. (CZ)
Buršík, Jiří (UFM-A) RID, ORCID
Zálešák, J. (CZ)
Buršíková, V. (CZ)
Brož, P. (CZ)Zdroj.dok. Science of Sintering - ISSN 0350-820X
Roč. 43, - (2011), s. 33-38Poč.str. 6 s. Jazyk dok. eng - angličtina Země vyd. BA - Bosna a Hercegovina Klíč. slova silver ; copper ; sintering Vědní obor RIV JG - Hutnictví, kovové materiály CEP GA106/09/0700 GA ČR - Grantová agentura ČR CEZ AV0Z20410507 - UFM-A (2005-2011) UT WOS 000294191600004 DOI 10.2298/SOS1101033S Anotace Addition of lead into based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead Into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique. Pracoviště Ústav fyziky materiálu Kontakt Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Rok sběru 2012
Počet záznamů: 1