Počet záznamů: 1  

Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction

  1. 1.
    SYSNO ASEP0353414
    Druh ASEPJ - Článek v odborném periodiku
    Zařazení RIVJ - Článek v odborném periodiku
    Poddruh JČlánek ve WOS
    NázevStudy of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction
    Tvůrce(i) Man, O. (CZ)
    Pantělejev, L. (CZ)
    Kunz, Ludvík (UFM-A) RID, ORCID
    Celkový počet autorů3
    Zdroj.dok.Materials Transactions. - : Japan Institute of Metals and Materials - ISSN 1345-9678
    Roč. 51, č. 2 (2010), s. 209-213
    Poč.str.5 s.
    Jazyk dok.eng - angličtina
    Země vyd.JP - Japonsko
    Klíč. slovaultra-fine grained copper ; thermal stability of microstructure ; electron back scattering diffraction ; grain size ; texture
    Vědní obor RIVJG - Hutnictví, kovové materiály
    CEP1QS200410502 GA AV ČR - Akademie věd
    CEZAV0Z20410507 - UFM-A (2005-2011)
    UT WOS000276538900003
    DOI10.2320/matertrans.MC200909
    AnotaceThermal stability of ultrafine-grained (UFG) structure of 99.9% pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at 180°C. The dwell times were in the range of 10 to 120 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the degree of decomposition of the UFG structure. Definition of grain boundaries was based on the misorientation angle of 1°. More advanced analysis of the EBSD results based on a kernel average misorientation (KAM) parameter was performed. Inverse pole figure maps did not reveal any substantial changes of UFG microstructure due to annealing. Some shift in the KAM modus in comparison with the initial state was observed but its magnitude was found negligible. Also changes in texture were found to be minor. On the other hand the microhardness increases with increasing time of annealing.
    PracovištěÚstav fyziky materiálu
    KontaktYvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485
    Rok sběru2011
Počet záznamů: 1  

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