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Recovery stress and shape memory stability in Ni-Ti-Cu thin wires at high temperatures
- 1.MOLNÁR, P., VAN HUMBEECK, J. Recovery stress and shape memory stability in Ni-Ti-Cu thin wires at high temperatures. International Journal of Materials Research. 2011, 102(11), 1362-1368. ISSN 1862-5282. E-ISSN 2195-8556. Dostupné z: doi: 10.3139/146.110596.
Počet záznamů: 1