Interaction of Silver Nanopowder with Cooper Substrate

0362863 - ÚFM 2012 RIV BA eng J - Článek v odborném periodiku
Sopoušek, J. - Buršík, Jiří - Zálešák, J. - Buršíková, V. - Brož, P.
Interaction of Silver Nanopowder with Cooper Substrate.
Science of Sintering. Roč. 43, - (2011), s. 33-38. ISSN 0350-820X
Grant CEP: GA ČR(CZ) GA106/09/0700
Výzkumný záměr: CEZ:AV0Z20410507
Klíčová slova: silver * copper * sintering
Kód oboru RIV: JG - Hutnictví, kovové materiály
Impakt faktor: 0.274, rok: 2011

Addition of lead into based solders represents a serious health risk and environmental problem. Lead-free solders represent one of the ways to remove pollution of lead Into environment, nevertheless, new advanced joining methods have to be considered. Aggregation effect of nanoparticles studied in this work seems to be an interesting alternative. It was found experimentally that Ag nanopowder annealed at temperatures above silver oxide decomposition forms continuous Ag layer and yields a firm junction between copper plates. Oxide layer is observed at the Cu-Ag interface. The oxide interlayer thickness reflects the temperature and annealing time. Microstructure of prepared experimental joints, composition profiles and local mechanical properties were studied on cross-sectional samples by analytical electron microscopy and depth-sensing indentation technique.
Trvalý link: http://hdl.handle.net/11104/0199045