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Characterization of creep behaviour and microstructure changes in pure copper processed by equal-channel angular pressing. Part I. Creep behaviour

  1. 1.
    0349224 - ÚFM 2011 RIV RU eng J - Článek v odborném periodiku
    Dvořák, Jiří - Sklenička, Václav - Král, Petr - Svoboda, Milan - Saxl, Ivan
    Characterization of creep behaviour and microstructure changes in pure copper processed by equal-channel angular pressing. Part I. Creep behaviour.
    Reviews on Advanced Materials Science. Roč. 25, č. 3 (2010), s. 225-232. ISSN 1606-5131. E-ISSN 1605-8127.
    [International Symposium on Bulk Nanostructures Materials /2./. Ufa, 22.09.2009-26.09.2009]
    Výzkumný záměr: CEZ:AV0Z20410507; CEZ:AV0Z10190503
    Klíčová slova: creep * copper * ultrafine-grained * ECAP
    Kód oboru RIV: JJ - Ostatní materiály
    Impakt faktor: 0.649, rok: 2010
    http://www.ipme.ru/e-journals/RAMS/no_32510/dvorak.pdf

    Coarse-grained high-purity copper was processed by equal-channel angular pressing (ECAP) through 1-12 passes and then tested under creep conditions at temperature ranging from 423 to 523K It was found that the creep resistance of the ECAP processed material was markedly improved with respect to unpressed material. The results revealed that the creep behaviour of pressed material strongly depends on the number of ECAP passes The ECAP material exhibits the highest creep resistance after the first ECAP pass However, successive ECAP passes lead to a noticeable decrease in the creep properties of the pressed copper The results indicate conventional power-law creep with a stress exponent of similar to`5 - 6 which is consistent with an intragranular dislocation process involving the glide and climb of dislocations
    Trvalý link: http://hdl.handle.net/11104/0189522

     
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