Počet záznamů: 1
Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering
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SYSNO ASEP 0386299 Druh ASEP J - Článek v odborném periodiku Zařazení RIV J - Článek v odborném periodiku Poddruh J Článek ve WOS Název Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering Tvůrce(i) Kroupa, Aleš (UFM-A) RID, ORCID
Andersson, D. (SE)
Hoo, N. (GB)
Pearce, J. (GB)
Watson, A. (GB)
Dinsdale, A. (GB)
Mucklejohn, S. (GB)Celkový počet autorů 7 Zdroj.dok. Journal of Materials Engineering and Performance. - : Springer - ISSN 1059-9495
Roč. 21, č. 5 (2012), s. 629-637Poč.str. 9 s. Jazyk dok. eng - angličtina Země vyd. US - Spojené státy americké Klíč. slova lead-free soldering, ; materials for high-temperature LF ; new technologies for HT lead-free soldering Vědní obor RIV BJ - Termodynamika Institucionální podpora UFM-A - RVO:68081723 UT WOS 000303455900010 DOI https://doi.org/10.1007/s11665-012-0125-3 Anotace The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (T M ≈ 220 °C), but the use of lead in the solders for high-temperature applications (>85% lead, T M ≈ 250-350 °C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is the subject of intensive research. This article tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys, and finally it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both the new materials and the new technologies may be viable solutions for production of reliable lead-free joints for high-temperature applications. Pracoviště Ústav fyziky materiálu Kontakt Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Rok sběru 2013
Počet záznamů: 1