Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition

0368128 - ÚFM 2012 RIV GB eng J - Článek v odborném periodiku
Kunz, Ludvík - Lukáš, Petr - Pantělejev, L. - Man, O.
Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition.
Strain. Roč. 2011, č. 47 (2011), 476–482. ISSN 0039-2103. E-ISSN 1475-1305
Výzkumný záměr: CEZ:AV0Z20410507
Klíčová slova: equal channel angular pressing * stability of ultrafine-grained microstructure * fatigue
Kód oboru RIV: JG - Hutnictví, kovové materiály
Impakt faktor: 1.103, rok: 2011

Effect of cyclic loading and thermal exposition on microstructure of bulk ultrafinegrained Cu prepared by equal channel angular pressing was experimentally investigated by means of electron backscattering diffraction and by transmission electron microscopy. Stability of the microstructure under stress-controlled cyclic loading with a tensile mean stress of 200 MPa was shown to be high. Neither dynamic grain coarsening nor development of bimodal microstructure was observed. However, annealing at 250 °C for 30 min resulted in formation of bimodal microstructure. Consequently, fatigue strength of annealed specimens was low.
Trvalý link: http://hdl.handle.net/11104/0006707