Automated system for optical inspection of defects in resist coated non-patterned wafer.

0512149 - ÚPT 2020 JO eng A - Abstrakt
Knápek, Alexandr - Drozd, Michal - Matějka, Milan - Chlumská, Jana - Král, Stanislav - Kolařík, Vladimír
Automated system for optical inspection of defects in resist coated non-patterned wafer.
Fourth International Symposium on Dielectric Materials and Applications (ISyDMA 4). Book of Abstracts. Amman: Jordan University of Science & Technology, 2019.
[The Fourth International Symposium on Dielectric Materials and Applications (ISyDMA 4). 02.05.2019-04.05.2019, Amman]
Grant CEP: GA MPO FV10618
Institucionální podpora: RVO:68081731
Klíčová slova: dielectric surface inspection * resist coated wafer
Kód oboru RIV: JA - Elektronika a optoelektronika, elektrotechnika

Quality control of the resist coating on the silicon wafer is one of the major task prior the exposition of patterns into the resist layer. Thus, the ability to inspect and identify the physical defect in the resist layer plays an important role. The absence of any unwanted defect in resist is an ultimate requirement for preparation of precise and functional micro- or nano-patterned surfaces. Currently used wafer inspection systems is mostly used in semiconductor or microelectronic industry to inspect non-patterned or patterned wafers (integrated circuits, photomasks, MEMS, etc.) in order to achieve production with high yield. Typically, they are based on acoustic micro imaging, optical imaging or electron microscopy. This paper presents design of a custom optical based inspection device for small batch lithography production that allows scanning a wafer surface with an optical camera and by analyzing the captured images to determine the coordinates (X, Y), size and type of the defects in the resist layer. In addition, a software that is responsible for driving the scanning device and for advanced image processing is presented.
Trvalý link: http://hdl.handle.net/11104/0302361