Process Maps for Plasma Spray. Part II:Deposition and Properties

0178833 - UFP-V 20000026 US eng A - Abstrakt
Jiang, X. - Matějíček, Jiří - Kulkarni, A. - Herman, H. - Sampath, S. - Gilmore, D. - Neiser, R.
Process Maps for Plasma Spray. Part II:Deposition and Properties.
Thermal Spray:Surface Engineering via Applied Research. Ohio: ASM Materials Park, 2000 - (Berndt, C.). s. 157-163. ISBN 0-87170-680-6.
[International Thermal Spray Conference/1st./. 08.05.2000-11.05.2000, Montreal]
Grant CEP: GA AV ČR NSF DMR9632570(US)
Výzkumný záměr: CEZ:AV0Z2043910
Kód oboru RIV: JG - Hutnictví, kovové materiály

This is the second paper of a two part series based on anintegrated study carried out the State University of New York at Stony Brook and Sandia National Laboratories.The aim the study is the fundamental understanding of the plasma-particle interaction,droplet substrate interaction,deposit formation dynamics and microstructure development as well as the deposit property.The purpose is to develop relationships,which can used to link processing to perfor
Trvalý link: http://hdl.handle.net/11104/0075689